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Semiconductor Test Socket

 

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3D MEMS Socket

for fine pinch BGA package

1) Pin Pitch
Min. 100um
2) Height100um ~ 1000um
3) Current-Carrying CapabilityMax. 1.5A/pin
4) Contact ForceMax. 5g/pin
5) Number of ContactMin. 50,000
6) ApplicationMemory / CPU / AP / FPGA